JPH0466381B2 - - Google Patents
Info
- Publication number
- JPH0466381B2 JPH0466381B2 JP62227260A JP22726087A JPH0466381B2 JP H0466381 B2 JPH0466381 B2 JP H0466381B2 JP 62227260 A JP62227260 A JP 62227260A JP 22726087 A JP22726087 A JP 22726087A JP H0466381 B2 JPH0466381 B2 JP H0466381B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing body
- resin
- cavity
- mold
- metal frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 claims description 53
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 14
- 238000001746 injection moulding Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62227260A JPS6469019A (en) | 1987-09-10 | 1987-09-10 | Method of sealing light-emitting diode with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62227260A JPS6469019A (en) | 1987-09-10 | 1987-09-10 | Method of sealing light-emitting diode with resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6469019A JPS6469019A (en) | 1989-03-15 |
| JPH0466381B2 true JPH0466381B2 (en]) | 1992-10-23 |
Family
ID=16858033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62227260A Granted JPS6469019A (en) | 1987-09-10 | 1987-09-10 | Method of sealing light-emitting diode with resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6469019A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141560A (ja) * | 2000-10-31 | 2002-05-17 | Seiwa Electric Mfg Co Ltd | Ｌｅｄランプ及びその製造方法 |
| DE10163116B4 (de) * | 2001-12-24 | 2008-04-10 | G.L.I. Global Light Industries Gmbh | Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei räumlich und zeitlich getrennten Stufen |
| DE10242947B8 (de) * | 2002-09-16 | 2009-06-18 | Odelo Led Gmbh | Verfahren zum Herstellen von LED-Körpern mit Hilfe einer Querschnittsverengung und Vorrichtung zur Durchführung des Herstellungsverfahrens |
-
1987
- 1987-09-10 JP JP62227260A patent/JPS6469019A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6469019A (en) | 1989-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |